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  1. CLC 16-228

    A two component, room temperature cure patching and sealing compound. This product has excellent adhesion to plastics and various metals. CLC 16-228

  2. CLP 7106 / CLI 4010

    Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010

  3. CLP 7330 / CLI 4161

    Economical, flexible, potting and casting polyurethane system. a solventless, low viscosity, flexible, two component polyurethane casting resin. CLP 7330 / CLI 4161

  4. CLR 1066 / CLH 6520

    Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

  5. CLR 1066 / CLH 6930

    Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930

  6. CLR 1180 / CLH 6770

    A two component, unfilled, room temperature cure epoxy, for coating, casting, and adhesive applications. CLR 1180 / CLH 6770

  7. CLR 1180 / CLH 6930

    Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930

  8. CLR 1190 / CLH 6025

    General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025

  9. CLR 1190 / CLH 6140

    General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140

  10. CLR 1190 / CLH 6560

    Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

  11. CLR 1796 / CLH 6580

    UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

  12. XRD 1347 / XHD 1348

    The product cures to a shore hardness of 50 A, low viscosity, soft system. A two component, very flexible epoxy system. XRD 1347 / XHD 1348

  13. XRD 1575 / XH 61418

    2:1 machine dispense adhesive. Bonding abrasive wheels and disks. A two component epoxy system suitable for potting, casting and adhesive applications. Product gels quickly and has good thermal cycling endurance. Material is filled with non-abrasive fillers making it suitable for machine dispensing. XRD 1575 / XH6 1418

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